Covestro showcases high-performance TPU solutions for AI-powered devices

Covestro, a global leader in high-performance polymers, is presenting its latest TPU material solutions in Taipei under the theme “The Material Effect,” demonstrating how its innovations enable performance upgrades in AI computing and embodied intelligence. On June 4, the company will host a seminar, “Grab the future of material effects in AI era,” featuring a technical session on sustainable TPU applications for service robots, AI laptops, and smart devices.

Alec Yang, Head of Sales and Market Development TPU Taiwan, highlighted Taiwan’s role as a hub for electronics and AI applications, noting Covestro’s APAC R&D centre and Changhua manufacturing site facilitate rapid development from R&D to mass production for local customers.

In robotics, TPU materials such as Desmopan IT, AIR, and FLY support high-frequency motion, abrasion resistance, hydrolysis resistance, antimicrobial properties, and skin-like softness for structural and tactile components. These enable enhanced cleaning, mobility, safe human-machine interaction, and reliable long-term performance in service and industrial robots. TPU also supports cable jacketing, electronic skins, and dynamic mechanical functions across devices.

In AI laptops and smart devices, Desmopan® XHR, IT, and CQ series TPUs deliver heat and wear resistance, flexibility, vibration damping, haptics, and over 80 per cent sustainable content using bio-based feedstocks. Applications include thermal management components, foot pads, panels, wearable devices, and smart bands, improving performance, comfort, hygiene, and environmental sustainability.

Kevin Ho, Head of Sales and Market Development TPU APAC, emphasised that material innovation drives both product performance and efficient development. Covestro’s TPU Application Development Centre in Guangzhou, working with the Taiwan R&D Centre, strengthens technical support across Asia Pacific, ensuring high-performance, sustainable materials accelerate the transition from validation to scalable deployment in the AI era.